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FOR THIN FILM INTERCONNECTS |
• Lowest cost conductors of anyone in the printed electronics arena.
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• Epic can utilize offset lithographic presses to generate micron features in micron thick films in a normal printing environment.
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• Epic has patent protection on utilizing and correcting office printers to accurately place fine features. See US Patent numbers 6,709,962 and 6, 746,946.
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• Epic has developed a method of utilizing an ordinary office printer with some low cost modifications to print directly on a rigid substrate.
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• Direct press printing of seeded traces and vias utilizing Epic’s polymer inks.
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• Epics low temperature solutions make possible reel to reel operations.
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• Polymer seeded coatings for direct electroless plating.
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• Epic’s conductors can have the resistance of copper.
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• The thin film process begins with a proprietary low cost nano-particle low conductive seed coating followed by a litho printed mask (with proprietary ink), and ends up with rapid low-cost electroless plating utilizing new chemistry.
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• The thin film process is ideal for low-cost RFID antennas, cell phones, throw-away electronics and many others that require extremely low cost.
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• Epic’s thin film process opens the door for the electronics industry to break the resolution barrier that the industry is currently facing.
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• Long term stability and low cost are salient features of the thin film process.
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• The process is 100% free of hazardous material which means that it has no negative environmental impact.
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• The thin film process is simple to use and doesn’t require a great deal of training.
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FOR PCB ENHANCEMENTS |
• New photolithography accomplished by a direct two-step process (Direct Mask) and can be used for rigid and flexible substrates. Epic’s Direct Mask will produce finer resolution than the PCB industry can achieve.
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• Epic’s environmentally friendly one solution process for cleaning substrates.
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• A simple process for making interconnects and holes conductive and seeded for metallic plating.
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• The substrate is prepared for metallic plating procedure with a two - solution method.
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• Field directed uniform electroplating.
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• The deformer is environmentally friendly.
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• Conventional photolithography used to apply solder screen and letter screen is eliminated by Direct Mask.
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Epic Research | 603-620-0491
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e-mail Ed Berg at Epic Research |
