Epic Research

Industry Practice	Photoplot (Make Films) Component Side, Solder Side, Letter Screen Component Side, Letter Screen Solder Side, Diazo Component Side, Diazo Solder Side, Diazo Letter Screen Component Side, Diazo Letter Screen Solder Side, Solder Mask Component Side, Solder Mask Solder Side, Diazo Solder Mask Component Side, Diazo Solder Mask Solder Side. 8 To 12 Films 24”x24”. Review And Check All Films (Phototools). .5 Hrs	Clean Substrate. .15 Hrs.	Drill Holes. .5 Hrs.	Make Holes Conductive. .75 Hrs.	Copper Flash Holes. .25 Hrs.	Clean Holes. .09 Hrs.	Coat Substrate With Photopolymer Resist. .1 Hrs.

The Epic Manufacturing Process	Not Needed. 0 Hrs.	Prepare Substrate. .08 Hrs.	Print Traces (Conductors).	Print For Vias.	Coat Substrate With Barrier Layer	Not Needed. 0 Hrs.	Not Needed. 0 Hrs.

	Dip Or Clean. .15 Hrs.	Inspection & Touchup. .15 Hrs.	Develop Photopolymer Resist. .08 Hrs.	Normalize Board. .15 Hrs.	Expose Photopolymer Resist. .15 Hrs.	Leaky Gasket Vacuum. .1 Hrs.	Position Phototools On Substrate Coated Photopolymer Resist. .1 Hrs.

	Clean Board.	Inspection & Touchup. .15 Hrs.	Not Needed. 0 Hrs.	Not Needed. 0 Hrs.	Direct Computer. .15 Hrs.	Not Needed. 0 Hrs.	Not Needed. 0 Hrs.

	Electro Plate Copper. .75 Hrs.	Electroplate Lead. .25 Hrs.	Remove Photopolymer Resist. .25 Hrs.	Etch. .16 Hrs.	Remove Lead Mask. .16 Hrs.	Reflow. .16 Hrs.	Not Needed. 0 Hrs.	Industry Total Time 4.95 Hrs.

	Not Needed. 0 Hrs.	Not Needed. 0 Hrs.	Not Needed. 0 Hrs.	Not Needed. 0 Hrs.	Not Needed. 0 Hrs.	Not Needed. 0 Hrs.	Immersion Tin. .25 Hrs.	Epic Total Time 1.1 Hrs. = 22% Of Industry

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